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Awards

Awards

The patent for the invention of spiral ultra-wideband microstrip quadrature directional coupler, which our company owns and applies in production process
In 2006 the company won the 1st place in the contest between small enterprises of the Central Administrative District of Moscow
The patent for the invention of the method of assembly of hybrid integrated circuits, which our company owns and applies in production process
The company is awarded with grand prix 'Golden Chip' at the ChipEXPO-2008 exhibition in the nomination 'For achievements in the development of Russian electronics'
The patent for the invention of the METHOD OF MICROPACK SEALING
The patent for the invention of the MICROSTRIP TANDEM DIRECTIONAL COUPLER
The patent for the invention of the SPIRAL ULTRA-WIDEBAND MICROSTRIP QUADRATURE DIRECTIONAL COUPLER

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